Products
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Along with custom manufacturing, Springfield Industries creates a handful of in-house products. Download our PDFs to view our products.
Our Innovations
Industry-Focused Products
Elastomer Modified Liquid Epoxy
Typically, a Bis-A or Bis-F liquid epoxy reacted with a functionalized elastomer (such as polysulfide or carboxyl-terminated butadiene acrylonitrile (CTBN)). The elastomer content can be adjusted but is typically in the range of 20 – 40%. This type of product is typically used in heat-activated epoxy systems to impart fracture toughness, improve strain to failure and improve impact resistance.
Elastomer Modified Solid Epoxy
Typically, a Bis-A type solid epoxy reacted with CTBN. The molecular weight of the solid epoxy and the elastomer content can be varied to achieve different performance attributes. This type of product is typically used in heat-activated epoxy systems to impart fracture toughness, improve strain to failure, and improve impact resistance.
Flame Retardant Epoxy
These products are reaction products of a difunctional epoxy with a reactive phosphorus-containing molecule. The end product has low viscosity and can be used to replace some of the existing epoxy resin in the formulation to add flame retardancy.
Thermoplastic-Modified Epoxy Resin
Solid epoxy containing aramid fiber. The molecular weight of the epoxy and the concentration of aramid fiber can be varied. Typically, 20% aramid fiber is added to a Type 2 or Type 4 solid epoxy resin. This product provides compounds with a high degree of shear-thinning behavior. It also provides excellent flow control with minimal effect on adhesion attributes.
Epoxy Accelerator & Hardener
Springfield Industries makes a proprietary high-molecular-weight phenoxy/epoxy thermoplastic that, when used in epoxy systems, can improve fracture toughness, impact resistance and strain to failure. Springfield offers this thermoplastic neat or as a dissolution in epoxy. The dissolution lowers the softening point of the thermoplastic, which enables mixing with heat-reactive constituents.
Fiber Masterbatch
Springfield Industries makes a substituted urea accelerator (SP-AD0052) for use in heat-activated epoxy systems. Typically, SP-AD0052 is used to lower the activation temperature of dicyandiamide (DICY)-cured epoxy systems. The typical use level of SP-AD0052 in a DICY system is 0.5 – 2%. Springfield also offers SP-EH3000, which is a latent, heat-activated epoxy hardener known as DICY.
Technical Data Sheets
Explore Springfield Industries’ in-house epoxy and specialty material products.
Contact our team for application guidance, formulation support, or product questions.
Additives & Modifiers
Elastomer Modified Liquid Epoxy Adduct
| Title | Content | Link |
|---|---|---|
| SP-8003 | Used to improve fracture toughness, impact resistance and strain to failure in heat-activated epoxy formulations. | Download |
| SP-8005 | Used to improve fracture toughness, impact resistance and strain to failure in heat-activated epoxy formulations. | Download |
| SP-8006 | Used to improve fracture toughness, impact resistance and strain to failure in heat-activated epoxy formulations. | Download |
Elastomer Modified Solid Epoxy Adduct
Epoxy Flexibilizer
Flame Retardant Epoxy Adduct
| Title | Content | Link |
|---|---|---|
| SP-EF0040A | Adds flame retardancy to a formulated system; ideal for use in adhesives and coatings. | Download |
Solid Epoxy - Aramid Masterbatch
| Title | Content | Link |
|---|---|---|
| SP-6201 | A rheological modifier mainly used in heat-activated formulations; can easily be fed into many mixing … | Download |
| SP-6202 | A rheological modifier mainly used in heat-activated formulations; can easily be fed into many mixing … | Download |
| SP-6204 | A rheological modifier mainly used in heat-activated formulations; can easily be fed into many mixing … | Download |
Formulated Adhesives
Epoxy-Based, Heat-Activated, Formulated Adhesive Powder
| Title | Content | Link |
|---|---|---|
| SP-GBRK | Specifically formulated as a heat-cured adhesive binder for filter fabrication, fiber bonding, and associated applications. | Download |
Hardeners & Accelerators
Aqueous Based Epoxy Curing Agent
| Title | Content | Link |
|---|---|---|
| SP-EH0020 | A water-based epoxy curing agent designed for aqueous epoxy coatings. | Download |
Fast-Curing Multi-Purpose Epoxy Hardener
| Title | Content | Link |
|---|---|---|
| SP-EH0050 | A clear, low-color, fast-curing agent for two-component epoxy systems. | Download |
Latent Epoxy Curative
| Title | Content | Link |
|---|---|---|
| SP-EH3000 | A latent curative for heat-activated epoxy systems. | Download |
Substituted Urea Accelerator
| Title | Content | Link |
|---|---|---|
| SP-AD-0052 | A dicyandiamide (DICY) accelerator in heat-activated epoxy resin systems. | Download |
Specialty Epoxy Resins
Dimer Acid Modified Epoxy
| Title | Content | Link |
|---|---|---|
| SP-EA0003 | Increases the strain to failure and fracture toughness of epoxy thermoset material. | Download |
Flame Retardant Epoxy Polymer
| Title | Content | Link |
|---|---|---|
| SP-EF1010 | Can be formulated into epoxy systems to add flame retardancy without significantly reducing the strength … | Download |
Impact Modified Epoxy Acrylate
| Title | Content | Link |
|---|---|---|
| SP-RR0010 | Used to improve the impact resistance and flexibility in UV coating systems. | Download |
Thermoplastic Modified Epoxy Resin
| Title | Content | Link |
|---|---|---|
| SP-TMEP28ASP | Improves fracture toughness, peel strength, and strain to failure without sacrificing glass transition temperature and … | Download |
| SP-TMEP70 | Improves fracture toughness, peel strength, and strain to failure without sacrificing glass transition temperature and … | Download |
| SP-TMEP70ASP | Improves fracture toughness, peel strength, and strain to failure without sacrificing glass transition temperature and … | Download |
| SP-TMEP100ASP | Improves fracture toughness, peel strength, and strain to failure without sacrificing glass transition temperature and … | Download |