SP-EH0050 wpmbdev8772 A clear, low-color, fast-curing agent for two-component epoxy systems. SP-EH0050 Read More »
SP-EH0020 wpmbdev8772 A water-based epoxy curing agent designed for aqueous epoxy coatings. SP-EH0020 Read More »
SP-AD-0052 wpmbdev8772 A dicyandiamide (DICY) accelerator in heat-activated epoxy resin systems. SP-AD-0052 Read More »